Appeal No. 1996-0203
Application No. 08/006,414
Claim 9 requires that the polyimide of claim 8 is a
particular polyimide, BPDA-PDA. Bakhru clearly discloses BPDA-
PDA is a well-known polyimide coating material. We agree with
the examiner's conclusion that, in light of DiStefano's
disclosure of polyimides as useful dielectric layers, it would
have been within the ordinary skill of the routineer to select
a particular, commercially available polyimide for use in
DiStefano's interconnect board.
Claim 3 requires that there is a metal adhesion layer
between the metal layer and the polymer layer. Claim 4
requires that the metal adhesion layer is selected from a
particular group of metals. We agree with appellants that
neither DiStefano nor DiStefano considered with Kumar disclose
or suggest a metal adhesion layer as required by claims 3 and
4. Because the examiner has not made out a prima facie case of
obviousness with respect to the subject matter in claims 3 and
4, we reverse the rejection of claims 3 and 4 under 35 U.S.C.
§ 103.
Claim 12 requires that the metal layer is etched to
provide the metal layer with a "knife-edge" configuration. We
agree with appellants that neither DiStefano nor King teaches
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