Appeal No. 1996-0203
Application No. 08/006,414
wherein at least one hole is filled with metal to form a "via
stud".
DiStefano describes a multilayer, laminated interconnect
board. In Figure 4 there is described at least one metal
ground layer 17 having via holes therethrough. The via holes
also go through a polyimide layer 14. The polyimide may be
Kapton and conforms to the metal ground layer. As a polyimide
dielectric layer, layer 14 is an insulator. The holes are
subsequently filled with metal (column 3, lines 59 through 64)
to connect the conductors 16 to the vias. Thus, DiStefano
describes, in the sense of 35 U.S.C. § 102(b), the subject
matter claimed by appellants in claim 1.
In reaching the above conclusion, we have not overlooked
appellants' arguments found on pages 12 through 14 of the
brief. However, most of appellants' arguments either concern
limitations not found in claim 1 or concern features found in
the art but not excluded by the scope of claim 1.
Specifically, because claim 1 does not recite that it is
directed to a transferable interconnect structure, the failure
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