Appeal No. 1996-0203
Application No. 08/006,414
of DiStefano to disclose a transferable interconnect structure
does not diminish the weight of its disclosure. Moreover,
DiStefano does describe an interconnect board. Even more
significantly, we do not find that the preambular description
of the structure in claim 1 describes a limitation of the
claimed structure but only describes an intended end-use for
the structure.
Further, none of claims 1, 5 through 7, 10 or 11 recites
or requires "a metal seed layer" or "an adhesion layer".
Further, because claim 1 is a "comprising" claim, the adhesive
layer, the first organic dielectric layer and the organic
dielectric layer of DiStefano are not excluded from the
structure claimed in claim 1. Claim 2 further limits the
"polymer" from claim 1 to a "high-temperature stable
insulator". However, appellants do not define the meaning of
the relative term "high temperature" and DiStefano does
describe polyimide insulators. For all these reasons, and
because anticipation has been held to be the epitome of
obviousness, we affirm the rejection of claims 1, 2 and 5
through 8, 10 and 11 under 35 U.S.C. § 103.
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