Appeal No. 96-1142
Application 07/939,180
application.
THE INVENTION
Appellants claim a process for laminating thermoplastic
moldings by use of a recited heat-activatable adhesive.
Appellants indicate that due to the recited weight ratio of
the specified dispersions in the adhesive, the adhesive has a
low activation temperature (specification, page 3, lines 27-
30; page 14, lines 2-7). Claim 7 is illustrative and reads as
follows:
7. A process for laminating thermoplastic moldings with
heat-activatable adhesive films softened by heat, comprising
applying the adhesive to a surface of the molding and
contacting the surface with another molding surface to which
the adhesive is optionally applied, wherein the heat-
activatable adhesive film comprises a mixture containing:
A) at least one aqueous dispersion of a polymer which has
a softening point of below 70EC, said dispersion containing
5 to 70% by weight solids and having a film-forming
temperature below 70EC, and
B) at least one aqueous dispersion of a polymer based on
olefinically unsaturated monomers having a softening
point above 70EC, said dispersion containing 5 to 70% by
weight solids,
wherein the weight ratio of dispersions A) to despersion B) is
from 97:3 to 60:40, based on the solids content of said
dispersions
2
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