Appeal No. 96-1313
Application 08/202,536
illustrative and reads as follows:
10. A method for depositing a metal onto a substrate,
comprising the step of immersing said substrate in an
electroless metal plating bath having a composition which
includes:
water;
a soluble source of metal ions;
a soluble source of mediator ions, different from said
metal ions, chosen from the group consisting of palladium
ions, platinum ions, silver ions, ruthenium ions, iridium
ions, osmium ions and rhodium ions;
a first complexing agent for at least said metal ions;
and
a reducing agent for reducing said mediator ions.
THE REFERENCE
Morgan et al. (Morgan) 5,158,604 Oct. 27,
1992
THE REJECTION
Claims 10-18 and 25-27 stand rejected under 35 U.S.C.
surface of the mediator metal and existing metallic layer.”
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