Appeal No. 96-2404
Application No. 08/112,446
the final rejection. These are all of the claims remaining in
the application.
The subject matter on appeal relates to a process of
producing an IC card having cover films laminated over a core
sheet with an adhesive layer as well as non-adhesive areas
between the cover films and core sheet which comprises the
step of cutting a cover film and core sheet along the outer
peripheries of the non-adhesive areas to form a cavity for
receiving an IC module. Further details of this appealed
subject matter are readily apparent from a study of
representative independent claim 1 which reads as follows:
1. A process of producing an IC card, said IC card
comprising a card substrate and an IC module embedded therein,
said card substrate comprising a single core sheet and first
and second cover films laminated over the core sheet on the
opposite sides, said process comprising the steps of:
(a) forming an adhesive layer on the inside of each
of said first and second cover films while maintaining non-
adhesive areas, formed at respective inner surfaces of
said first and second cover films in which said IC module
is to be fitted, free of any adhesive;
(b) assembling said card substrate by bonding said
cover films to the opposite sides of said core sheet by
the interposition of said adhesive layers and hardening
said adhesive layers;
(c) cutting said first cover film and said core
sheet along the outer peripheries of said non-adhesive
2
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