Appeal No. 1997-1060
Application No. 08/172,848
redundant rows and columns have been implemented on the
semiconductor memory device. More specifically, through
external pins on the packaged semiconductor memory device,
three redundancy rollcall tests are performed on the device to
determine whether redundancy has been implemented, and to
identify the row addresses and the column addresses at which
redundancy has been implemented.
Claims 1, 11 and 37 are illustrative of the claimed2
invention, and read as follows:
1. A method of testing a packaged semiconductor memory
device to acquire information on redundant elements, said
method comprising the steps of:
configuring the device in a test mode; and
in response to configuring the device into a first test
mode, sensing a first programmed signal indicating that
redundancy has been implemented on the device, and changing
the state of at least one output pin when the first signal has
a preselected value.
11. A method of testing a semiconductor device to
acquire information on redundant elements, said method
comprising the steps of:
configuring the device for at least one test mode;
2In claim 37, line 7, it appears that the phrase “first
signal” should read –programmed signal--. This informality
should be corrected in any further prosecution that may occur.
2
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