THIS OPINION WAS NOT WRITTEN FOR PUBLICATION
The opinion in support of the decision being entered
today (1) was not written for publication in a law
journal and (2) is not binding precedent of the
Board.
Paper No. 16
UNITED STATES PATENT AND TRADEMARK OFFICE
____________
BEFORE THE BOARD OF PATENT APPEALS
AND INTERFERENCES
____________
Ex parte SHYH-MING CHANG, CHIH-CHIANG CHU and YU-CHI LEE
____________
Appeal No. 1997-1173
Application No. 08/428,7751
____________
ON BRIEF
____________
Before HAIRSTON, MARTIN and FLEMING, Administrative Patent
Judges.
HAIRSTON, Administrative Patent Judge.
DECISION ON APPEAL
This is an appeal from the final rejection of claims 1
through 4.
The disclosed invention relates to a bonded structure for
flip chip bonding between an integrated circuit element and a
1Application for patent filed April 24, 1995. The
application is a division of Application No. 08/239,380 filed
May 6, 1994, now Patent No. 5,431,328.
Page: 1 2 3 4 5 6 7 8 9 10 11 Next
Last modified: November 3, 2007