Appeal No. 1997-1173
Application No. 08/428,775
substrate. Specifically, the bonded structure provides
physical and electrical connections between input/output pads
on the integrated circuit element and input/output pads on the
substrate. Each of the physical and electrical connections
includes a soldering metal and a composite bump comprising a
polymer body coated with metals.
Claim 1 is illustrative of the claimed invention and
reads as follows:
1. A bonded structure, comprising:
an integrated circuit element having input/output pads;
a substrate having input/output pads; and
a plurality of physical and electrical connections
between said integrated circuit element input/output pads and
said substrate input/output pads wherein each said connection
includes a soldering metal and a composite bump comprised of a
single polymer body with a conductive metal coating covering
said polymer body wherein said physical and electrical
connections are formed by said soldering metal.
The references relied on by the examiner are:
Matsubara et al. (Matsubara) 2-180036 July
12, 1990
(Japanese Patent Application)
Feilchenfeld et al. (Feilchenfeld) 4,883,744 Nov.
28, 1989
Afzali-Ardakani et al. (Afzali-Ardakani) 5,397,863 Mar. 14,
1995
2
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