Appeal No. 1997-1173
Application No. 08/428,775
Accordingly, we conclude that one of ordinary skill in
the art would not interpret the claimed limitation “wherein
said physical and electrical connections are formed by said
soldering metal” to include the bonded structure such as that
disclosed by Matsubara in which the connections between
integrated circuit element input/output pads 11 and composite
bumps 15 (not between integrated circuit element input/output
pads 11 and substrate input/output pads 3) are formed by
soldering metal 20. Thus, we find that the examiner’s
interpretation of claim 1 is not reasonable. Since each
element of claim 1 is not found in
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