Appeal No. 1997-1693
Application No. 08/254,667
claims 5-9 and 12. Claims 1-4 have been canceled. Pending
claims 10 and 11 stand withdrawn from consideration as being
directed to a nonelected invention.
The claimed invention relates to a plastic mold type
semiconductor device in which the end portions of the inner
leads are located in an upper region of the mold body
spatially apart from the semiconductor chip. As described by
Appellants at page 4 of the specification, such an arrangement
serves to prevent damage to the chip resulting from pressure
exerted during a wire bonding operation.
Claim 5 is illustrative of the invention and reads as
follows:
5. A plastic mold type semiconductor device comprising:
a bed of a lead frame;
a semiconductor chip having electrodes on the periphery
of an upper surface thereof, said semiconductor chip being
supported by the bed and having an edge defining one end of
said semiconductor chip, said edge being substantially
perpendicular with respect to said upper surface;
a mold body in which said semiconductor chip is sealed,
said mold body having an interior region defined within said
mold body, said interior region being further defined by an
upper region above said semiconductor chip and a lower region
below said semiconductor chip, said upper region being further
defined by a first upper region and a second upper region
2
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