Appeal No. 1997-1693
Application No. 08/254,667
contiguous with said first upper region and abutting said
first upper region along a plane passing through said edge of
said semiconductor chip, wherein said plane is perpendicular
with respect to said upper surface of said semiconductor
surface, and said first upper region extends exteriorly with
respect to said semiconductor chip and said second upper
region extends above said semiconductor chip;
leads, each having an outer lead portion projecting from
said mold body and an inner lead portion extending into the
upper region of said mold body spatially apart from the upper
surface of said semiconductor chip within said mold body, said
inner lead portion extending through both said first upper
region and said second upper region; and
bonding wires for connecting said electrodes of said
semiconductor chip to corresponding points on said inner lead
portions, said points being located in said first upper region
in a location exterior of said semiconductor chip and
spatially apart from said semiconductor chip.
The Examiner relies on the following prior art:
Takahashi et al. (Takahashi) 5,198,883 Mar.
30,
1993
(filed Jul. 19,
1989)
Itaru (Japanese Kokai) 2 62-296541 Dec. 23,
1987
Claims 5-9 and 12 stand finally rejected under 35 U.S.C.
2A copy of the translation provided by the U. S. Patent
and Trademark Office, December 1966, is included and relied
upon for this decision.
3
Page: Previous 1 2 3 4 5 6 7 8 9 10 Next
Last modified: November 3, 2007