Appeal No. 1999-0422 Page 6
Application No. 08/628,805
being equal to the dimension (i), which denotes the width of
the grooves.
One of ordinary skill in the art at the time of the
appellants' invention would have understood from the above-
noted disclosure that the distance between the planes defined
by the wave peaks is equal to or slightly larger than (within
engineering tolerances) the width of the grooves so that the
wavy profile of the fins will fit snugly within the grooves so
as to be secured or clamped therein. Accordingly, we
interpret the language "corresponds approximately" in claim 9
as meaning equal to or slightly larger than (within
engineering tolerances).
With this understanding, we turn now to the prior art
applied by the examiner.
Serizawa discloses a radiation plate for cooling
semiconductor substrates (column 1, line 14) comprising a base
(10) having grooves (12) therein and thin plate fins (14)
having engaging portions (16) for securing the fins in the
grooves. As explained in detail from column 4, line 33, to
column 5, line 13, the fins are inserted into the grooves (12)
in a horizontal direction from the ends of the grooves; after
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