Appeal No. 1997-0068
Application 07/923,278
layer 550 of resin onto support surface 534 which
layer is of generally uniform thickness, typically
0.15 mm. Following application of a resin layer
thereto, the surface 534 is positioned in operative
engagement with, and under exposure unit 530, such
that the mask [515] formed on substrate 514 lies
intermediate the light source and the layer 550 in
proximity to layer 550 . . . permitting exposure
of the layer 550 through the mask 515 and consequent
hardening of the exposed regions of the layer 550.
. . .
The mask 515 together with its substrate 514 is
returned to the mask producing subsystem 502 for
cleaning and preparation of a subsequent mask. . .
.
While a subsequent mask is being produced, the
model generation process continues: the exposed
layer 550 is positioned in operative engagement with
a fluid strip generator 560 for removal of
unhardened resin from layer 550 . . . .
The thus cleaned layer 550 is then transported
into operative engagement with a support material
applicator unit 570 . . . [to] provide a support
material to fill in those regions in layer 550 from
which the unsolidified solidifiable material was
removed. Preferably the support material comprises
a melted wax . . . .
After application of the melted wax to layer
550, the layer is preferably transported into
operative engagement with a cooling unit 580 . . .
. The wax [in] layer 550 is cooled by intimate
contact with cooled plate 582 in order to solidify
it as quickly as possible prior to further
processing . . . .
Following solidification of the wax in layer
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