Appeal No. 1997-0166
Application No. 08/409,933
not overcome the deficiencies of Yabe and Merrin with respect to the claimed limitations regarding the
passivation layer, as set forth, supra.
Accordingly, we will reverse the rejection of claims 16 and 26 under 35 U.S.C. § 103. As
claims 11-15, 27 and 28 depend from claim 26, the rejection of these claims on the same grounds as
claim 26, is also reversed.
Turning now to claims 20 and 24, which depend from claims 17 and 21, respectively, these
claims contain limitations similar to those of claims 16 and 26 as claims 20 and 24 additionally recite a
passivation layer disposed on the surface of the semiconductor substrate and on a surface of the
electrode pad. Accordingly, the rejection of claims 20 and 24 under 35 U.S.C. § 103 is reversed for
the same reasons as the rejection of claims 16 and 26.
Turning now to the rejection of claim 25, appellants assert that the references do not disclose or
suggest a film carrier tape (11) of a resin substantially the same as a resin of the resin film (6). The
examiner’s position is that as shown in figure 8 of appellants’ disclosure, the carrier tape claimed is the
same as the TAB (tape adhesive bonding) of Yabe. We find that while Yabe discloses TAB lead 7,
and that TAB lead 7 will attach to a carrier tape, Yabe does not disclose a disclose a film carrier tape
formed of a resin substantially the same as a resin of the resin film (6). Appellants’ disclose
(specification, page 10) that:
Since the polyimide resin film 6 and film carrier tape 11 are made of the same-based
resin, a better heat resistance cycle property can be obtained in a semiconductor
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