Appeal 97-1618
Application 08/368,078
3. With respect to the third rejection, claims 4,
10 and 12 stand or fall with claim 2.
4. Hence, at most it would be necessary to consider
only claims 1-3. However, as will become apparent, we need
consider only the broadest claim, which is claim 1.
The claimed invention
5. The invention is readily understood by reference
to Figs. 1 and 3 of applicants' drawings and claim 1, which
reads (matter in brackets, drawings and drawing numbers
added):
A method of bonding two wafers, comprising the steps
of:
[1] providing an (sic--a) first wafer 12 having a first
major surface 14 and a second major surface and
having a rounded edge;
[2] providing a second wafer 10 having a first major
surface [surface adjacent first wafer] and a second
major surface and having a rounded edge;
[3] bonding the first wafer and the second wafer so that
the first major surface of the second wafer is
adjacent the second major surface of the first
wafer; [Fig. 1]
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