Appeal 97-1618
Application 08/368,078
by grinding so that the second major surface of the
first wafer is supported by the first major surface
of the second wafer, after the step of bonding, and
wherein the diameter of the second wafer remains[3]
essentially the same.
Discussion
The examiner's well-written answer bottoms the first
rejection on the proposition that Nomura establishes that
grinding and chemical etching are "interchangeable for their
desired function" (Examiner's Answer, page 7). Thus, the
examiner reasons that given the admitted prior art and Ito
'435 processes of etching, it would have been obvious to use
grinding in place of etching. While superficially plausible,
the examiner's reasoning does not withstand penetrating
analysis.
Applicants point out that "[t]he grinding apparatus of
Nomura could not be used to grind away only the edge of the
active wafer (see at least FIGSs. 3A and 6 of Nomura) ***"
(Appeal Brief, page 4). Claim 1 on the other hand requires
The diameter is not shown in the drawings; it is understood that wafer are round3
(see Nomura, Fig. 1).
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Last modified: November 3, 2007