Appeal 97-1618
Application 08/368,078
and
[4] removing a portion of the first wafer from the[2]
rounded edge into a portion of the first wafer
[Fig. 3]
The specification explains the meaning of portion as follows: "[t]he grinding2
at edge 18 must remove substantially all of the portion of the active wafer 12 that is
not supported by or not bonded to base wafer 10" (specification, page 3, lines 30-32).
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Last modified: November 3, 2007