Appeal No. 1997-3338
Application No. 08/402,252
planarize the surface of the metallic layer, and
etching the metallic layer and the titanium nitride
film according to a predesignated wiring pattern to
form at least the first wiring layer. [Col. 1, l. 62
to col. 2, l. 14).
Thus, it appears that JP ‘546 teaches a process which is
similar to that recited in the appealed claims. Both the
examiner and the appellants should obtain a complete English
language translation of JP ‘546 and consider the reference in
its entirety. Further, the examiner and the appellants should
explore whether there is any motivation or suggestion to
combine the teachings of JP ‘546 with Koyanagi or Scovell and,
if so, whether the combination would result in the invention
recited in the appealed claims. In this regard, we point out
that Scovell teaches the benefits of using the TiSi/TiN layers
as produced according to step (b) of appealed claim 4 (column
2, lines 4-38).
The decision of the examiner is reversed.
REVERSED
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