Appeal No. 1997-3635 Application No. 08/498,357 fails to provide any teachings related to different layer thicknesses such that one of ordinary skill in the art would have modified them in order to form the metal and the silicon layers having thicknesses as claimed by Appellant. Accordingly, we reverse the rejection of claims 3, 8, 15, and 16 under 35 U.S.C. § 103 over Wong. With regard to the rejection of claims 1 through 3, 5, 8, 9, 11, 12, 14, 16, and 19 under 35 U.S.C. § 103 over Yu and Japan '414, Appellant argues on pages 11 and 12 of the brief that neither reference suggests the combination. Appellant further points out that Japan '414 teaches a method for preventing surface oxidation whereas Yu discloses the formation of undesired native oxide layer during diffusion of impurities. Appellant concludes that Yu’s diffusion step and the method disclosed by Japan '414 cannot be combined since they are related to oxide layers formed at different stages of processing. Appellant further argues that the combination of references does not teach a method for in-situ forming of a composite silicon and metal layer having low resistivity. The Examiner responds to Appellant’s arguments on page 7 of the answer by stating that the motivation for combining the 15Page: Previous 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 NextLast modified: November 3, 2007