Ex parte CHEN et al. - Page 1




               The opinion in support of the decision being entered                   
               today was not written for publication and is not                       
               precedent of the Board.                                                
                                                       Paper No. 36                   

                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                  ________________                                    
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                  AND INTERFERENCES                                   
                                  ________________                                    
                Ex parte FUSEN E. CHEN, FU-TAI LIOU and CHE-CHIA WEI                  
                                  ________________                                    
                                Appeal No. 1997-3769                                  
                               Application 08/418,257                                 
                                  ________________                                    
                                      ON BRIEF                                        
                                  ________________                                    
          Before KRASS, MARTIN and JERRY SMITH, Administrative Patent                 
          Judges.                                                                     
          KRASS, Administrative Patent Judge.                                         


                                 DECISION ON APPEAL                                   
               This is a decision on appeal from the final rejection of               
          claims 1, 3-11 and 18-28, all of the claims pending in the                  
          application.                                                                
               The invention pertains to a method for forming a metal                 
          contact in an integrated circuit.  More particularly, an                    
          improved interlevel contact is said to be achieved by                       
                                         -1-                                          





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