Appeal No. 1997-3769
Application 08/418,257
temperature rising step is deposited on another aluminum layer
which was produced during a first step in Armstrong’s process.
Since there is no indication that this first aluminum layer
may be considered the “refractory metal” layer, as claimed,
again, Armstrong fails to teach or suggest the claimed deposit
of aluminum on a refractory metal layer, said deposit
beginning during the temperature raising step.
While a refractory metal layer may have been well known
in the art, as apparently contended by the examiner in
referring to admitted prior art, we find no reason, and
certainly no reason clearly articulated by the examiner, as to
why the skilled artisan would have combined the statements of
admitted prior art in the instant specification with the
Armstrong disclosure in such a manner as to arrive at the
instant claimed invention wherein aluminum is begun to be
deposited on a refractory metal layer during a temperature
raising step. Wolf, applied as a standard text to show that
there is inherent heating during an aluminum sputter
deposition process, is of no help in this regard. The claimed
temperature raising step entails raising the temperature from
below approximately 350 degrees Centigrade to a value between
-5-
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