Appeal No. 1997-4069 Page 3
Application No. 08/282,913
1. A method of testing an integrated circuit
in a system level environment using an actual
electrical system in which answer the integrated
circuit is intended to be used to operate the
integrated circuit during the testing, the
integrated circuit being part of a module which
makes up part of the electrical system and the
integrated circuit to be tested being operatively
connected to the electrical system when the testing
occurs, the method comprising the steps of:
exposing a die in a packaged integrated circuit
to be tested;
placing the module that incorporates the exposed
die on a test platform and positioning a sensor
probe relative to the exposed die such that the
sensor probe can directly monitor the die during
testing;
operating the electrical system in a manner
which exercises the exposed die; and
using the sensor probe to directly monitor the
die while the exposed die is being exercised by the
operation of the electrical system in which the
integrated circuit is intended to be used.
The references relied on in rejecting the claims follow:
Choi et al. (Choi) 4,862,075 Aug. 29,
1989
Baerg et al. (Baerg) 4,980,019 Dec. 25,
1990
Huppenthal 5,162,728 Nov. 10,
1992
Hurley et al. (Hurley) 5,475,316 Dec. 12,
1995. (Filed Dec. 27,
1993)
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