Appeal No. 1997-4069 Page 12
Application No. 08/282,913
a multiplicity of components mounted on the
printed circuit board, ... including an integrated
circuit on a silicon die that is mounted over the
prober testing opening such that a sensor probe can
access the die through said prober testing opening
....
In summary, the claims each recite an IC die mounted over an
opening in a printed circuit board (PCB) so that a sensor
probe can access the die through the opening.
The examiner fails to show a teaching or suggestion of
the claimed limitations. He admits, “Not explicitly disclosed
by Choi is an integrated circuit on a silicon die that is
mounted over [a] prober [sic] testing opening such that a
sensor probe can access the die through testing opening ....”
(Examiner’s Answer at 8.)
Hurley, in turn, teaches “an improved transportable
emission microscope for testing semiconductor circuits.” Col.
1, ll. 7-8. “A departure from prior art is the direct access
of the emission microscope objectives to the die face of the
DUT.” Col. 7, ll. 38-39. The microscope omits a fixed stage.
“Where a stage (the focal plane of the objectives) would
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