Appeal No. 1998-0786
Application No. 08/464,118
Claim 2 is representative of the subject matter on appeal
and reads as follows:
2. A process for connecting circuits comprising the steps
of:
(a) forming a filmy adhesive layer on the surfaces of
projecting electrodes of a semiconductor wafer formed with a
plurality of integrated circuit elements having the pressure-
deformable electrodes projecting from the main face, said
adhesive comprising a liquid epoxy resin, a solid resin having
a functional group and a micro-capsule type curing agent;
(b) cutting said wafer along with the adhesive layer to
form chips, and positioning the projecting electrodes of said
chips with opposing circuits on a wiring substrate through the
medium of the adhesive layer to set the chips in place
correctly, and
(c) substantially curing the adhesive after the
projecting electrodes have been contacted with the opposing
circuits by heating and pressing said chips and wiring
substrate together; the projecting electrodes being contacted
with the opposing circuits by heating to a temperature of 40
to 250°C while applying a pressure in the range of from 1 to
100 kgf/cm .2
As evidence of obviousness, the examiner relies on the
following prior art:
Bentov et al. (Bentov) 3,167,602 Jan. 26,
1965
Breen 3,600,246 Aug. 17,
1971
Fujiwara et al. (Fujiwara) 3,741,858 Jun. 26,
1973
Celling 3,811,183 May 21,
1974
2
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