Appeal No. 1998-0786
Application No. 08/464,118
Various methods, such as mentioned below,
are available for affording pressure-
deformability to the projecting electrodes 2;
and extendable material (for example, the
materials having an elongation of 40% or more,
shown in METAL DATA BOOK, p, 155, 1984, compiled
by Japan Metallurgical Society and pub. by
Maruzen Co., Ltd.) such as gold, solder, copper,
aluminum, silver, lead, titanium or the like is
used as the electrode material; fine unevenness
is formed at the end of the convex electrode as
shown in FIGS. 3 and 4 to reduce the portion to
be pressed (deformed portion; the grain boundary
structure at the time of plating is enlarged.
It is preferred to use the above-described
techniques in combination. Also, the electrodes
may be formed with a pressure-deformable
material such as a thermoplastic material and
their surfaces coated with a metal.
The use of the pressure deformable electrodes allows the
improvement in connection between the electrodes and the
opposing circuits, without causing mechanical break of
electronic parts, substrates and/or circuits. See
specification, pages 11, 12 and 13. Moreover, the application
of the specific adhesive film on the wafer prior to cutting
prevents scattering of chips during the cutting operation.
See specification, pages 17 and 19. The properties of the
specific adhesive film appear to play an important role in
avoiding contamination associated with using the adhesive film
prior to cutting. See specification, page 17.
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