Appeal No. 1998-0786
Application No. 08/464,118
Pallie et al. (Pallie) 4,617,357 Oct. 14,
1986
Hatada 4,749,120 Jun. 7,
1988 Claims 1 and 7 stand rejected under 35 U.S.C. § 103
as unpatentable over the combined disclosures of Hatada,
Breen, Fujiwara, Pallie and Bentov. Claim 5 stands rejected
under 35 U.S.C. § 103 as unpatentable over the combined
disclosures of Hatada, Breen, Fujiwara, Pallie, Bentov and
Ceiling.
We reverse each of the foregoing rejections. Our reasons
for this determination follow.
The claimed subject matter is directed to a process for
connecting circuits. The process involves, inter alia,
forming a specific adhesive film on the surface of pressure
deformable projecting electrodes of a semiconductor wafer,
cutting the wafer along with the adhesive film to form chips
and substantially curing the adhesive film after contacting
the pressure deformable electrodes with opposing circuits
under specific heating and pressing conditions. According to
page 12 of the specification, the pressure deformable
electrode is defined as follows:
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