Ex parte KROPP et al. - Page 1




               The opinion in support of the decision being entered                   
               today was not written for publication and is not                       
               binding precedent of the Board.                                        
                                                               Paper No. 23           


                      UNITED STATES PATENT AND TRADEMARK OFFICE                       
                                  ________________                                    
                         BEFORE THE BOARD OF PATENT APPEALS                           
                                 AND INTERFERENCES                                    
                                  ________________                                    
                  Ex parte LAWRENCE A. KROPP, DAVID STANASOLOVICH,                    
                         MARC J. WEISS and DENNIS SEK-ON YEE                          
                                  ________________                                    
                                Appeal No. 1998-1211                                  
                             Application No. 08/448,955                               
                                  ________________                                    
                                      ON BRIEF                                        
                                  ________________                                    

          Before KIMLIN, OWENS and KRATZ, Administrative Patent Judges.               
          KIMLIN, Administrative Patent Judge.                                        



                                 DECISION ON APPEAL                                   
               This is an appeal from the final rejection of claims 4-7,              
          12 and 15-27, all the claims remaining in the present                       
          application.  Claims 4 and 7 are illustrative:                              
          4.   A method of fabricating a semiconductor device including               
          the steps of                                                                

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