Appeal No. 1998-2142 Page 3
Application No. 08/125,189
The appellants' localized heating device comprises a
laminate structure of a heat insulating substrate, a heating
region made by sandwiching a heating layer between a pattern
electrode layer and a conductive layer, and a low surface
energy layer. The appellants' localized heating apparatus
includes their localized heating device. More specifically, a
power supply selectively supplies a current to part of the
pattern electrode layer, and the corresponding portion of the
heating layer selectively generates heat. Supplying current
to only the part to which pressure is applied limits the heat
required and speeds the heating. Furthermore, the temperature
of the heated layer can be reduced almost to the ambient
temperature in a short time.
Claim 3, which is representative for our purposes,
follows:
3. A localized heating device, comprising a
laminate structure made by laminating a heating
region formed by sandwiching a heating layer
directly between a pattern electrode layer and a
conductive layer on a heat insulating substrate and
laminating a low surface energy layer on the heating
region.
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