Appeal No. 1999-1759
Application No. 08/749,614
used to extend or retract the wafer blade as the robot is
being rotated about motors 51 and 52," and thus is clearly
suggestive of a wafer blade path that includes simultaneous
rotation and extension of the robot mechanism. Moreover, we
note the IEEE papers incorporated by reference into the
disclosure of the applied Lucas patent (col. 2, lines 18-37),1
wherein there is a clear
1For appellant's convenience, copies of these IEEE papers
are attached to this decision.
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