Appeal No. 1998-0078
Application No. 08/478,814
BACKGROUND
The invention is directed to etching equipment that etches a semiconductor wafer.
The equipment includes an etching apparatus for main etching, a post processing apparatus
for removing a resist film remaining on the etched object after the main processing and a
means for transferring the object between the etching apparatus and the post processing
apparatus. The post processing apparatus is capable of both light etching and ashing the
etched object by switching between two gas supply sources. Claim 26 and 27 are attached
as an appendix to this decision.
In determining patentability of the claimed subject matter, the Examiner relies on
the following references:
Otsubo et al. (Otsubo) 4,479,848 Oct. 30, 1984
Savage 5,014,217 May 7, 1991
Maher et al. (Maher) 5,344,542 Sep. 6, 1994
(filed Dec. 16, 1991)
Amemiya et al. (Amemiya) 5,385,624 Jan. 31, 1995
(filed Nov. 29, 1991)
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