Appeal No. 1998-2215
Application 08/700,578
fixing which comprises an electrically and thermally
conductive layer (5) having a thickness of 1,200 D (0.12 µm),
an adhesion prevention layer formed on a surface of the
conductive layer and
having a thickness of 0.05-7 µm, preferably 0.1-1 µm, and a
heat generating layer having a thickness of 0.3-150 µm formed
on another surface of the conductive layer (col. 2, lines 39-
63; col. 3, lines 62-67; col. 6, lines 48-50 and 65-68). A
wear-resistant contact resistance layer (8), which preferably
is electrically discontinuous in its longitudinal direction,
can be formed on the heat generating layer to prolong the life
of the device (col. 6, lines 9-15; col. 7, lines 1-9; figure
2).
The examiner argues that “Akutsu shows one example which
includes a 50 micron thick heat generating layer and a
0.12 micron thick conductive support layer , but later states [1]
1As correctly pointed out by the appellants (brief,
page 9), Akutsu does not refer to the conductive layer as a
support layer.
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