Ex parte CHRONEOS et al. - Page 1




             The opinion in support of the decision being entered today was not written
                   for publication and is not binding precedent of the Board.         
                                                                 Paper No. 17         
                       UNITED STATES PATENT AND TRADEMARK OFFICE                      
                                     ____________                                     
                          BEFORE THE BOARD OF PATENT APPEALS                          
                                   AND INTERFERENCES                                  
                                     ____________                                     
                   Ex parte ROBERT J. CHRONEOS and KOUSHIK BANERJEE                   
                                     ____________                                     
                                 Appeal No. 1998-3130                                 
                              Application No. 08/626,174                              
                                     ____________                                     
                                       ON BRIEF                                       
                                     ____________                                     
          Before KRASS, DIXON, and BARRY, Administrative Patent Judges.               
          BARRY, Administrative Patent Judge.                                         



                                  DECISION ON APPEAL                                  
               This is a decision on appeal under 35 U.S.C. § 134 from                
          the  rejection of claims 6-18.  We reverse.                                 


                                     BACKGROUND                                       
               The invention at issue in this appeal relates to packages              
          for integrated circuits (ICs).  ICs are typically housed                    
          within a package soldered to a printed circuit board (PCB).  A              
          conventional package contains a heat slug to remove heat                    
          generated by the IC.  The package features through hole vias                





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