Appeal No. 1998-3130 Page 3
Application No. 08/626,174
Claim 16, which is representative for our purposes,
follows:
16. A method for assembling an electronic
package, comprising the steps of:
a) providing a printed circuit board which has
a plurality of contacts on a bottom surface and a
plurality of vias on an opposite top surface;
b) mounting a heat slug to said top surface of
said printed circuit board, said heat slug having at
least five flat sides that intersect each other and
are essentially perpendicular to said top surface;
c) mounting an electrical device to said top
surface of said printed circuit board at a location
between said heat slug and said vias.
The reference relied on in rejecting the claims follows:
Banerjee et al. (Banerjee) 5,557,502 Sep. 17, 1996
(filed Mar. 2,
1995).
Claims 6-18 stand rejected under 35 U.S.C. § 103(a) as obvious
over Banerjee. Rather than repeat the arguments of the
appellants or examiner in toto, we refer the reader to the
briefs and answer for the respective details thereof.
OPINION
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