Appeal No. 1999-0878
Application 08/182,093
DECISION ON APPEAL
This is a decision on appeal under 35 U.S.C. § 134 from
the final rejection of claims 14-16, 19-25, and 27-31.
We reverse.
BACKGROUND
The invention is directed to a semiconductor device which
has a minimum size and which can be easily tested and
inspected. Claim 22 is reproduced below. Claim 22 is
broader than claim 14 because it does not contain the2
additional limitation of "a sloping side for facilitating
visual inspection."
22. A semiconductor device having at least one
chip including at least one connecting site, comprising:
a first electrically insulating means directly
coating a surface of the at least one chip;
at least one electrical connection means penetrating
the first electrically insulating means to contact the at
least one connection site of the at least one chip and to
connect the at least one connecting site of the at least
one chip to a metallized contact means formed on an
outside surface of said first electrically insulating
means, wherein the at least one electrical connection
lead is substantially perpendicular to both the at least
one connection site of the at least one chip and the
metallized contact means.
We note for the record that claim 14 is reproduced2
incorrectly in the appendix to the brief.
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