Appeal No. 1999-0878
Application 08/182,093
plate 80 is spaced from the surface of the chip and is not an
"electrically insulating material directly coating a surface
of the at least one chip" (emphasis added) (claim 14) or
"electrically insulating means directly coating a surface of
the at least one chip" (emphasis added) (claim 22); and
(2) the ends of the S-shaped wires 84 pass through connector
plate 80 and a solder connection is made to each power
post 64, signal post 67, and ground post 72 (col. 4, line 67
to col. 5, line 1) and, thus, there is no "metallized contact
formed on an outside surface of said first electrically
insulating material" (claim 14) or "metallized contact means
formed on an outside surface of said first electrically
insulating means" (claim 22).
The Examiner concludes in the final rejection (FR2): "It
would [have] be[en] considered obvious to one having ordinary
skill in this art to form insulating layer 18 [sic, 80]
directly on the surface [of] chip 16 [sic, 18] because
insulating substrates [sic, layers?] formed directly on chip
surfaces are not new in this art and are typically provided
thereon."
- 5 -
Page: Previous 1 2 3 4 5 6 7 8 9 10 11 Next
Last modified: November 3, 2007