Appeal No. 2000-0622
Application No. 08/650,894
The disclosed invention relates to a method for fabricating
a multi-chip module. In the fabrication method, a plurality of
semiconductor packages are tested prior to retaining and sealing
the packages within a housing.
Claim 82 is the only independent claim on appeal, and it
reads as follows:
82. A method for fabricating a multi-chip-module
comprising:
a) providing a plurality of semiconductor packages,
each package comprising a plurality of package leads and a
semiconductor die;
b) testing the packages, by performing functionality
testing, adherence to required specifications testing, and
burn-in testing;
c) providing a housing for retaining the packages
comprising a plurality of conductive traces and a plurality
of external leads in electrical communication with the
traces;
d) placing passing packages from the testing step
within the housing and electrically coupling the passing
packages and the conductive traces; and
e) sealing the passing packages within the housing.
The references relied on by the examiner are:
Falanga 4,746,583 May 24, 1988
Ahn et al. (Ahn) H606 Mar. 7, 1989
Sugano et al. (Sugano) 5,028,986 Jul. 2, 1991
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