Appeal No. 2000-0622
Application No. 08/650,894
Claims 82 through 84, 87, 88 and 91 stand rejected under
35 U.S.C. § 103(a) as being unpatentable over Sugano in view of
Falanga.
Claims 85 and 86 stand rejected under 35 U.S.C. § 103(a) as
being unpatentable over Sugano in view of Falanga and well-known
prior art.
Claims 89 and 90 stand rejected under 35 U.S.C. § 103(a) as
being unpatentable over Sugano in view of Falanga and Ahn.
Reference is made to the brief (paper number 42) and the
answer (paper number 43) for the respective positions of the
appellants and the examiner.
OPINION
We have carefully considered the entire record before us,
and we will reverse the obviousness rejection of claims
82 through 91.
Appellants and the examiner disagree as to whether Sugano
performs tests on the tape mounted chips prior to packaging and
sealing them on a connector housing. According to the examiner
(answer, page 6), “Sugano is explicitly and clearly shown to
teach a process comprising functionality and burn-in testing of
semiconductor packages prior to sealing in a housing.”
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