Appeal No. 2000-2118
Application No. 08/995,139
component housing and are bent towards the rear face of the
housing. The component may be placed on the board in two
different positions providing for an optical path either
perpendicular or parallel to the board surface. Additionally, in
either position, the component is placed and aligned on the
circuit board by both the supporting surfaces provided on the
lateral face and the rear side of the housing as well as the bent
external connecting leads.
Representative independent claim 1 is reproduced below:
1. An optoelectronic component for data transmission
(1) with a radiation-emitting semiconductor chip (4.1)
arranged on a first part of a conductor strip (3.1) and a
semiconductor chip (5.1) that responds to radiation arranged
on a second part of the conductor strip (3.1) and with a
housing (2) that in certain sections at least is transparent
for the radiation used for data transmission and which
encloses the conductor strip (3.1) with the exception of the
external connecting legs (3) of the conductor frame, all of
which protrude from a single lateral face of the housing
wherein all external connecting legs (3) are bent for the
first time immediately behind the housing (2) such that they
extend along the lateral face; and wherein all external
connecting legs (3) are bent a second time at the edge to
the rear side of the housing (2) such that they extend along
the rear side; and wherein supporting surfaces (6,7) on
which the housing rests are arranged on the lateral face at
which the connecting legs emerge from the housing and on the
rear side of the housing as required for the respective
direction of mounting.
2
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Last modified: November 3, 2007