Appeal No. 2000-2118
Application No. 08/995,139
USPQ 785, 787-88 (Fed. Cir. 1984); In re Cofer, 354 F.2d 664,
668, 148 USPQ 268, 271-72 (CCPA 1966).
A review of Rosenberg confirms that the reference relates to
an optical transceiver having a package assembly that is
adaptable to different mounting positions by different ways of
bending the external leads (col. 1, lines 57-65). Rosenberg
further teaches that the package (as depicted in figures 3a-3d)
includes leads 126 emerging from one side and lead frame tabs 124
extending from two other opposing sides as well as molded
mounting feet 128 provided on the back side of the package. As
leads 126 are bent differently for various mounting positions,
mounting feet 128 and/or different configurations of lead frame
tabs 124 provide structural support for the package (col. 3 lines
20-24). However, even if lead frame tabs 124 can be considered
as support surfaces, they are on the sides different from the
side where leads 126 emerge.
Lee, on the other hand, relates to the use of clip-type
leads in a semiconductor chip package which does not require
modification of the lead frame structure for different mounting
positions. We also note that although Lee provides a chip
package that may be mounted in both vertical and horizontal
positions (col. 3, lines 63-65), nothing in the reference points
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