Ex Parte HAZE et al - Page 4




               Appeal No. 2002-1061                                                                          Page 4                   
               Application No. 09/358,365                                                                                             


               1532, 28 USPQ2d 1955, 1956 (Fed. Cir. 1993).  A prima facie case of obviousness is                                     
               established by presenting evidence that would have led one of ordinary skill in the art to                             
               combine the relevant teachings of the references to arrive at the claimed invention.                                   
               See In re Fine, 837 F.2d 1071, 1074, 5 USPQ2d 1596, 1598 (Fed. Cir. 1988) and In re                                    
               Lintner, 458 F.2d 1013, 1016, 173 USPQ 560, 562 (CCPA 1972).                                                           


                       Claim 1, the only independent claim on appeal, reads as follows:                                               
                               A method for producing a double-sided wiring board comprising the steps                                
                       of:                                                                                                            
                               providing a conductive substrate having first and second opposing                                      
                       conductive surfaces;                                                                                           
                               forming a first insulating layer on said first conductive surface of said                              
                       substrate;                                                                                                     
                               forming at least one via hole in said first insulating layer on said first                             
                       conductive surface;                                                                                            
                               thermally curing said first insulating layer on said first conductive surface,                         
                       resulting in said second conductive surface having a first oxidized layer thereon;                             
                               removing said oxidized layer formed on said second conductive surface of                               
                       said conductive substrate;                                                                                     
                               forming a second insulating layer on said second conductive surface from                               
                       which said first oxidized layer is removed;                                                                    
                               forming at least one via hole in said second insulating layer; and                                     
                               forming thin conductive wiring on the surfaces of both said first and                                  
                       second insulating layers, including within both of said via holes, said forming of                             
                       said thin conductive wiring on both said first and second insulating layers                                    
                       involving using only a single plating process.                                                                 



                       The Admitted Prior Art discloses a method for producing a double-sided wiring                                  
               board comprising the steps of: (1) providing a conductive substrate having first and                                   







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