Appeal No. 2002-1061 Page 6
Application No. 09/358,365
especially useful in multilayer printed circuit fabrication and in the treatment of copper
circuit lines and areas which are disconnected from each other, that is, which do not
have electrically conductive continuity. Adlam further teaches that inner-layer laminates
prepared according to this process are not susceptible to "pink-ring" formation, exhibit
excellent resistance to chemical attack at drilled holes and sheared edges and are
stable under thermal and mechanical stresses.
After the scope and content of the prior art are determined, the differences
between the prior art and the claims at issue are to be ascertained. Graham v. John
Deere Co., 383 U.S. 1, 17-18, 148 USPQ 459, 467 (1966).
Based on our analysis and review of the Admitted Prior Art and claim 1, it is our
opinion that the differences are: (1) the thermally curing of the first insulating layer on
the first conductive surface resulting in the second conductive surface having a
first oxidized layer thereon; (2) removing the oxidized layer formed on the second
conductive surface of the conductive substrate; and (3) forming thin conductive
wiring on the surfaces of both the first and second insulating layers, including within
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