Appeal No. 2002-1061 Page 7
Application No. 09/358,365
both of the via holes, the forming of the thin conductive wiring on both the first and
second insulating layers involving using only a single plating process.2
In the rejection of claim 1 before us in this appeal, the examiner determined
(answer, p. 4) that
[i]t would have been obvious to one of ordinary skill in the art at the time
the invention was made to modify [the Admitted Prior Art] by removing the
oxidized layer formed on the second conductive surface of the conductive
substrate, as taught by Adlam, for the purpose of promoting strong adhesion
between adjacent copper foils and polymeric substrates which imparts superior
mechanical, thermal and electrical properties and avoids the delimitation [sic,
delamination] and loss of adhesion attendant to the so-called pink-ring or "halo"
effect.
The appellants argue that the applied prior art does not suggest the claimed
subject matter. We agree. In that regard, while it may have been obvious at the time
the invention was made to a person of ordinary skill in the art to have applied the
teachings of Adlam to the Admitted Prior Art's conductive substrate having first and
second opposing conductive surfaces prior to forming any insulating layer thereon by
treating the first and second opposing conductive surfaces with an oxidizing agent to
form a black copper oxide and then treating the black oxide-coated copper surfaces
2 The examiner's determination (answer, p. 3) that the Admitted Prior Art discloses "forming thin
conductive wiring on both insulating layers using only a single plating process" finds no support in the
disclosure of the Admitted Prior Art and therefore is not sound.
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