Appeal No. 2002-1061 Page 5
Application No. 09/358,365
second opposing conductive surfaces; (2) forming a first insulating layer on the first
conductive surface of the substrate; (3) forming at least one via hole in the first
insulating layer on the first conductive surface; (4) thermally curing the first insulating
layer on the first conductive surface; (5) forming a second insulating layer on the
second conductive surface; (6) forming at least one via hole in the second insulating
layer; (7) applying a first copper plating process to outer surfaces of the first and
second insulating layers to form first and second copper layers; (8) applying a second
copper plating process to outer surfaces of the first and second copper layers to form
third and fourth copper layers; and (9) forming thin conductive wiring (i.e., circuits) from
the first, second third and fourth copper layers, including within both of the via holes.
Adlam's invention relates to a bond enhancement process for promoting strong,
stable adhesive bonds between surfaces of copper foil and adjacent resin impregnated
substrates or superimposed metallic sublayers. According to the process of Adlam's
invention, the initial step is to treat a surface of the copper foil with an oxidizing agent to
form a black copper oxide (CuO). Then, the black oxide-coated copper surface is
treated with an aqueous reducing solution containing sodium metabisulfite and sodium
sulfide to convert the black oxide coating to a roughened metallic copper coating. The
roughened metallic copper-coated surface is then passivated and laminated to a resin
impregnated substrate. Adlam teaches that the bond enhancement process is
Page: Previous 1 2 3 4 5 6 7 8 9 10 Next
Last modified: November 3, 2007