Appeal No. 2002-1183
Application 08/975,549
contrast, functional testing 2 merely tests whether or
not the IC is functional, without measuring whether or
not the IC meets parameter specifications. . . .
After parametric test 4, a parametric data sort 5
is done so that integrated circuits with similar
parameters can be grouped together. . . .
Packaging process 6 and 6' for group one and group
two are similar since the integrated circuits
themselves are similar except for parameter
differences. Integrated circuits from each group are
selected from the wafer and placed on leadframes so
that each leadframe contains integrated circuits from
only one group. . . . After the ICs are bonded to the
leadframe, wire bonds are formed coupling contact pads
on the integrated circuit to leads on the leadframe.
After wire bond, integrated circuits and a portion of
the leads are encapsulated, preferably in plastic.
. . .
While the packaged integrated circuits are still
attached to the leadframe, the packages are marked with
an indication of the manufacturer[’]s part type and
other information, indicated by process steps 7 and 7'
in the figure. . . .
After marking 7 and 7', . . . [t]he leads which
extend from the package body are trimmed at trim
operation 8 so that each of the leads is electrically
independent of the others. Trim 8 separates the leads
from the leadframe; but tie bars which hold the package
to the leadframe are not cut. . . .
Once the leads are electrically isolated from each
other, the integrated circuits can be functionally
tested once again to identify any failures caused by
the assembly process. Second functional test 9 is
preferably done in the same piece of equipment as trim
8, sort 10, and sleeve insertion 11 . . . .
Final processing is shown by process blocks 10 and
11 in the figure. After functional test 9 is complete,
the leads may be bent into any desired shape to meet a
customer[’]s specification. After the leads are bent,
also called lead forming, the tie bars are cut to
remove or singulate the packages from the leadframe.
4
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Last modified: November 3, 2007