Ex Parte SCHONAUER et al - Page 11



          Appeal No. 2002-1992                                                        
          Application 09/206,170                                                      
          because it is known to satisfactorily remove surface residue and            
          contamination” (answer, page 5).                                            
               In Grieger’s method, removal of the doped silica is to be              
          minimized (abstract; col. 12, lines 49-52), whereas in the                  
          Schonauer ‘769 method, a very shallow depth of the surface is               
          intentionally etched away (col. 3, lines 30-34).  The examiner              
          has not explained, and it is not apparent, why the applied                  
          references would have led one of ordinary skill in the art to               
          combine these methods.                                                      
               As for combining the teachings of Chen and Schonauer ‘769,             
          the teaching in Schonauer ‘769 that his etching solution rapidly            
          dissolves Ti (col. 4, lines 14-42) is evidence that this etching            
          solution is not compatible with all metals.5  The examiner has              
          not provided evidence or technical reasoning which shows that one           
          of ordinary skill in the art would have reasonably expected the             
          Schonauer ‘769 etching solution to be compatible with Chen’s                
          copper wiring.  Like Schonauer ‘769 (col. 3, lines 34-38),                  
          Grieger uses a cleaning solution which contains HF (abstract).              




               5                                                                      
               5 The wiring metal which is disclosed in Schonauer ‘769                
          (col. 2, lines 14-19) and recited in the claims is tungsten.                
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