Ex Parte CIMA et al - Page 6




          Appeal No. 1998-2813                                                        
          Application No. 08/463,203                                                  


          20-30, wherein it is noted that a defined porosity can be                   
          introduced into the implant by various methods and that such                
          processes "offer a range of porosities available to tailor FFM              
          devices to specific applications."  While Fink does indicate that           
          the methods therein can be used to provide an implant that                  
          replicates bone, we observe that this patent also teaches                   
          secondary manipulation of the "design file" to compensate for the           
          anticipated healing process, prior to forming the "sliced file"             
          that is actually used to fabricate the implant (col. 5, lines               
          44+).  Moreover, Fine also discloses (col. 6, line 20, et. seq.)            
          that while the implant may be matched to the precise anatomical             
          dimensions of the original tissue, it may also be modified to               
          compensate for the anticipated healing responses or to provide              
          for surgical-assist structures.  Thus, appellants' arguments that           
          Fink deals strictly with replication of bone and that the                   
          porosity of bone is smaller than that necessary to allow seeding            
          of cells mischaracterize the disclosure of Fink and are therefore           
          of no moment.  In this regard, we again note that Fink discloses            
          that pore sizes of "at least" 200-300 micrometers in diameter are           
          necessary in osteoconductive materials to permit ingrowth of                
          vasculature and osteogenic cells, and that a known matrix                   
          material is composed of a network of interconnecting pores in the           
          range of approximately 200 µm diameter.                                     

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