Appeal No. 1999-2122
Application No. 08/564,659
atoms from the target on the surface of the substrate and on the
walls of the groove in the substrate.
124. In a method of providing a deposition of sputtered
atoms, the steps of:
providing a planar substrate with a groove in the substrate,
the groove being defined by walls, the steps of:
providing a planar anode in a spaced and substantially
parallel relationship to the substrate,
providing a target in spaced relationship to the anode to
define a cavity, the target having a hollow frusto-conical
configuration with an axis substantially perpendicular to the
planar anode and the planar substrate,
providing a positive voltage on the anode and, on the target,
a voltage negative relative to the positive voltage to establish an
electrical field between the anode and the target and to establish
a glow discharge between the anode and the target for the emission
of electrons from the target and the movement of the electrons
toward the anode,
introducing atoms of a neutral gas into the cavity,
providing a substantially constant magnetic field in a
direction substantially perpendicular to the electrical field to
facilitate the production of charged particles from the atoms of
the neutral gas by the electrons and the movement of the charged
particles toward the target for the sputtering of atoms from the
target and the movement of the sputtered atoms toward the
substrate,
the positive voltage on the anode and the negative voltage on
the target having a difference to obtain a deposition of the
sputtered atoms on the substrate and a deposition on the walls of
the groove in the substrate with particular characteristics,
the sputtered atoms flowing from the target to the substrate
without obstruction from the anode and the production of the
magnetic field.
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