Appeal No. 1999-2122
Application No. 08/564,659
125. In a method as set forth in claim 124 wherein
the positive voltage on the anode and the negative voltage on
the target have values to provide a deposition of the sputtered
atoms with a substantially uniform thickness on the substrate and
on the walls of the groove in the substrate.
126. In a method as set forth in claim 124 wherein
the positive voltage on the anode and the negative voltage on
the target have values to provide a substantial filling of the
groove of the substrate with the sputtered atoms and to provide the
deposition of the sputtered atoms with a substantially planar
surface on the substrate including the filled groove.
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