Appeal No. 2001-2039
Application No. 09/110,207
BACKGROUND
Appellants’ invention is directed to a structure and a
method for manufacturing of an electrostatic chuck that holds a
semiconductor substrate during wafer processing. The chuck
includes two insulated electrodes connected to the opposite poles
of a power supply which causes a semiconductor substrate to be
electrostatically attracted to the top surface of the chuck.
Representative independent claim 3 is reproduced below:
3. An electrostatic chuck for holding a substrate
comprising:
a first electrode having a recess therein;
an insulating layer formed over a part of the first
electrode surface which is in the recess;
a second electrode provided in the recess of the first
electrode; and
an electrostatic attraction layer formed over the
surface of the first electrode and the second electrode
which is provided in the first electrode;
wherein a voltage is applied to the first electrode and
the second electrode to electrostatically attract the
substrate; and
wherein the insulating layer formed in the recess of
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